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Products
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AccuThermo AW 610 RTP
AccuThermo AW 610 is a desktop rapid thermal processor
for 2 to 6 inch wafer, which uses high-intensity, visible
radiation to heat single wafer for short periods at precisely controlled
temperatures. These capabilities, combined with the heating chamber's
cold-wall design, superior heating uniformity advanced temperature control
technology and AW 900 new software, provide significant advantages over
conventional furnace processing and conventional RTP systems.
AccuThermo AW 610 key features include:
Wafer Size:2 to 6 inch.
Quartz liners for BPSG/PSG processing with special Quartz Tube instead of the
standard Quartz Tube(Option)
Advanced ERP Pyrometer for precise high temperature measurement (See Detail
ERP Pyrometer)
Add timer watch for the oven safety issue (the original has no safety
interlock for the computer locks up, chamber would be burned if the computer
locks up when process running).
The new software with power summary function to detect either lamp failure or
sensor failure
Manual Operation
Use Sumpower as a parameter to control the uniformity of the wafer.
Closed-loop temperature control with pyrometer or thermocouple temperature
sensing.
Precise time-temperature profiles tailored to suit specific process
requirements.
High-intensity visible radiation heats wafers for short periods. Fast heating
and cooling rates unobtainable in conventional technologies.
Consistent wafer-to-wafer process cycle repeatability.
Elimination of external contamination.
Small footprint and energy efficiency.
Software calibration and easy to be done.
More functions and I/O hardware “exposed” for easier maintenance and trouble
shooting.
It is easy to edit recipe with GUI and graph display.
Save all process data on the computer hard disk.
A/D and D/A precision is 14 to 16 bits.
Detect in process and with color curve displayed on the screen.
Lamp damage detect in process.
Sensor status detect function.
On line help function
AccuThermo AW 610 RTA RTP is a versatile tool, which is useful for
many applications:
• Ion Implant Activation
• Polysilicon Annealing
• Oxide Reflow
• Silicide Formation
• Contact Alloying
• Oxidation and Nitridation
• GaAs Processing
Typical Application Area:
- Chip Maufacture
- Compound
Industry:GaAs, GaN, GaP, GaInP,InP and SiC
- Optronics:Planar
optical waveguides,LASERs, LEDs and VCSELs
- Biomedical
- MEMS
- Nanotechnology
- Solar Cell
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